Invention Grant
- Patent Title: Light emitting diode and fabrication method thereof
- Patent Title (中): 发光二极管及其制造方法
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Application No.: US14718026Application Date: 2015-05-20
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Publication No.: US09190572B2Publication Date: 2015-11-17
- Inventor: Lingfeng Yin , Suhui Lin , Jiansen Zheng , Lingyuan Hong , Chuangui Liu , Yide Ou , Gong Chen
- Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Current Assignee: Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma
- Priority: CN201210558990 20121221
- Main IPC: H01L33/42
- IPC: H01L33/42 ; C23C14/35 ; H01L33/38 ; H01L33/00 ; C23C14/58 ; C23C14/02

Abstract:
A light emitting diode includes: a substrate; a light-emitting epitaxial layer, from bottom to up, laminated by semiconductor material layers of a first confinement layer, a light-emitting layer and a second confinement layer over the substrate; a current blocking layer over partial region of the light-emitting epitaxial layer; a transparent conducting structure over the current blocking layer that extends to the light-emitting epitaxial layer surface and is divided into a light-emitting region and a non-light-emitting region, in which, the non-light-emitting region corresponds to the current blocking layer with thickness larger than that of the light-emitting region, thus forming a good ohmic contact between this structure and the light-emitting epitaxial layer and reducing light absorption; and a P electrode over the non-light-emitting region of the transparent conducting structure, which guarantees current spreading performance and reduces working voltage and light absorption.
Public/Granted literature
- US20150255682A1 Light Emitting Diode and Fabrication Method Thereof Public/Granted day:2015-09-10
Information query
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