Invention Grant
US09194038B2 Thin film forming apparatus, thin film forming method, and shield component
有权
薄膜形成装置,薄膜形成方法和屏蔽部件
- Patent Title: Thin film forming apparatus, thin film forming method, and shield component
- Patent Title (中): 薄膜形成装置,薄膜形成方法和屏蔽部件
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Application No.: US12974245Application Date: 2010-12-21
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Publication No.: US09194038B2Publication Date: 2015-11-24
- Inventor: Akihiro Egami , Toshikazu Nakazawa , Katsuhiro Suzuki , Shinya Hasegawa
- Applicant: Akihiro Egami , Toshikazu Nakazawa , Katsuhiro Suzuki , Shinya Hasegawa
- Applicant Address: JP Kawasaki-shi
- Assignee: CANON ANELVA CORPORATION
- Current Assignee: CANON ANELVA CORPORATION
- Current Assignee Address: JP Kawasaki-shi
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2009-296786 20091228; JP2010-274888 20101209
- Main IPC: C23C14/00
- IPC: C23C14/00 ; C23C14/34 ; C23C14/56 ; C23C16/44 ; C23C16/455 ; C23C16/458 ; H01J37/32 ; H01J37/34

Abstract:
The inventors of this invention conducted a test and found out that to prevent peel-off of an adherent film, it is not of essential importance to set the radius of curvature equal to or larger than a predetermined threshold. The inventors of the present invention also found out that peel-off of an adherent film occurs in the region in which the curvature of a shield changes and is less likely to occur when the change in curvature of the shield is small. Accordingly, the key to the problem is the magnitude of a change in curvature of the shield, so changing the curvature stepwise makes it possible to suppress a large change in curvature, and thus to prevent peel-off of an adherent film free from any disadvantages such as deterioration in film thickness distribution, which may occur due to an increase in size of the shield.
Public/Granted literature
- US20110155059A1 THIN FILM FORMING APPARATUS, THIN FILM FORMING METHOD, AND SHIELD COMPONENT Public/Granted day:2011-06-30
Information query
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