Invention Grant
US09195602B2 System including hierarchical memory modules having different types of integrated circuit memory devices
有权
系统包括具有不同类型的集成电路存储器件的分级存储器模块
- Patent Title: System including hierarchical memory modules having different types of integrated circuit memory devices
- Patent Title (中): 系统包括具有不同类型的集成电路存储器件的分级存储器模块
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Application No.: US12529323Application Date: 2008-03-19
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Publication No.: US09195602B2Publication Date: 2015-11-24
- Inventor: Craig Hampel , Mark Horowitz
- Applicant: Craig Hampel , Mark Horowitz
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Lowenstein Sandler LLP
- International Application: PCT/US2008/057471 WO 20080319
- International Announcement: WO2008/121559 WO 20081009
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G06F12/08 ; G06F13/16 ; G11C5/04 ; G11C7/10 ; G11C29/12 ; G11C29/00

Abstract:
A memory system is disclosed comprising a memory controller and a first set of volatile memory devices defining a first memory hierarchy. The first set of volatile memory devices are disposed on at least one first memory module, which is coupled to the memory controller in a daisy-chained configuration. A first integrated circuit buffer device is included on the module. The system has a second set of nonvolatile memory devices defining a second memory hierarchy. The second set of nonvolatile memory devices are disposed on at least one second memory module, which is coupled to the at least one first memory module in a daisy-chained configuration. The second module includes a second integrated circuit buffer device. The system is configured such that signals transmitted between the memory controller and the second memory hierarchy pass through the first memory hierarchy.
Public/Granted literature
- US20100115191A1 System Including Hierarchical Memory Modules Having Different Types Of Integrated Circuit Memory Devices Public/Granted day:2010-05-06
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