Invention Grant
- Patent Title: Heat sink layer along an aperture of a near-field transducer
- Patent Title (中): 沿着近场换能器的孔的散热层
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Application No.: US14183009Application Date: 2014-02-18
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Publication No.: US09196269B2Publication Date: 2015-11-24
- Inventor: Lina Cao , Weibin Chen , Werner Scholz
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: Hollingsworth Davis, LLC
- Main IPC: G11B5/23
- IPC: G11B5/23 ; G11B5/31 ; G11B5/40 ; G11B5/00

Abstract:
A recording head includes a near-field transducer proximate a media-facing surface. The near-field transducer includes an aperture surrounded by walls of plasmonic material and a notch protruding within the aperture. The walls are oriented normal to the media-facing surface. A write pole is proximate the near-field transducer. The write pole has a back surface facing away from the media-facing surface and an aperture-facing surface proximate the aperture. A heat sink layer of the plasmonic material is disposed along the back surface and the aperture-facing surface of the write pole. The heat sink layer is thermally and optically coupled to the near-field transducer.
Public/Granted literature
- US20150235658A1 HEAT SINK LAYER ALONG AN APERTURE OF A NEAR-FIELD TRANSDUCER Public/Granted day:2015-08-20
Information query
IPC分类: