Invention Grant
- Patent Title: On-die termination apparatuses and methods
- Patent Title (中): 片上终端设备和方法
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Application No.: US14045521Application Date: 2013-10-03
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Publication No.: US09196321B2Publication Date: 2015-11-24
- Inventor: Brian W. Huber , Vijay Vankayala , Brian Gross , Gary Howe , Roy E. Greeff
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C7/02 ; G11C5/06 ; G11C7/10 ; G11C29/02

Abstract:
Apparatuses and methods are disclosed herein, including those, performed by a memory die, that operate to detect that a command on a bus connected to the memory die is addressed to another memory die responsive to a chip select signal, and to change the impedance of an on-die termination circuit of the memory die responsive to the detecting.
Public/Granted literature
- US20150098285A1 ON-DIE TERMINATION APPARATUSES AND METHODS Public/Granted day:2015-04-09
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