公开(公告)号：US09196321B2

公开(公告)日：2015-11-24

申请号：US14045521

申请日：2013-10-03

Applicant: Micron Technology, Inc.

Inventor： Brian W. Huber ,  Vijay Vankayala ,  Brian Gross ,  Gary Howe ,  Roy E. Greeff

IPC: G11C7/00 ,  G11C7/02 ,  G11C5/06 ,  G11C7/10 ,  G11C29/02

CPC classification number: G11C7/02 ,  G11C5/063 ,  G11C7/1057 ,  G11C7/1084 ,  G11C29/025 ,  G11C29/028 ,  G11C2207/105

Abstract: Apparatuses and methods are disclosed herein, including those, performed by a memory die, that operate to detect that a command on a bus connected to the memory die is addressed to another memory die responsive to a chip select signal, and to change the impedance of an on-die termination circuit of the memory die responsive to the detecting.

Abstract translation: 本文公开的装置和方法包括由存储管芯执行的装置和方法，其操作用于检测连接到存储管芯的总线上的命令是否响应于芯片选择信号寻址到另一存储器管芯，并且改变阻抗 存储器管芯的片上终端电路响应于检测。

公开(公告)号：US20150098285A1

公开(公告)日：2015-04-09

申请号：US14045521

申请日：2013-10-03

Applicant: Micron Technology, Inc.

Inventor： Brian W. Huber ,  Vijay Vankayala ,  Brian Gross ,  Gary Howe ,  Roy E. Greeff

IPC: G11C7/02

CPC classification number: G11C7/02 ,  G11C5/063 ,  G11C7/1057 ,  G11C7/1084 ,  G11C29/025 ,  G11C29/028 ,  G11C2207/105

Abstract: Apparatuses and methods are disclosed herein, including those, performed by a memory die, that operate to detect that a command on a bus connected to the memory die is addressed to another memory die responsive to a chip select signal, and to change the impedance of an on-die termination circuit of the memory die responsive to the detecting.

Abstract translation: 本文公开的装置和方法包括由存储管芯执行的装置和方法，其操作用于检测连接到存储管芯的总线上的命令是否响应于芯片选择信号寻址到另一存储器管芯，并且改变阻抗 存储器管芯的片上终端电路响应于检测。