Invention Grant
US09196535B2 Method and apparatus for separating semiconductor devices from a wafer
有权
用于从晶片分离半导体器件的方法和设备
- Patent Title: Method and apparatus for separating semiconductor devices from a wafer
- Patent Title (中): 用于从晶片分离半导体器件的方法和设备
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Application No.: US13920541Application Date: 2013-06-18
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Publication No.: US09196535B2Publication Date: 2015-11-24
- Inventor: Mathias Vaupel , Kurt Gehrig , Kian Pin Queck
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: SpryIP, LLC
- Main IPC: B32B38/10
- IPC: B32B38/10 ; H01L21/78 ; H01L21/67 ; H01L21/683
Abstract:
An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.
Public/Granted literature
- US20140367015A1 METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER Public/Granted day:2014-12-18
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