公开(公告)号：US09196535B2

公开(公告)日：2015-11-24

申请号：US13920541

申请日：2013-06-18

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Kurt Gehrig ,  Kian Pin Queck

IPC: B32B38/10 ,  H01L21/78 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/78 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/67098 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/10 ,  Y10T156/1121 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1911 ,  Y10T156/1922 ,  Y10T156/1939

Abstract: An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.

Abstract translation: 用于从晶片分离半导体器件的实施例方法包括使用对半导体器件施加可调整的粘合力的载体，并通过对载体施加机械或声学冲击而从载体上移除半导体器件。

公开(公告)号：US09984927B2

公开(公告)日：2018-05-29

申请号：US14949691

申请日：2015-11-23

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Kurt Gehrig ,  Kian Pin Queck

IPC: B32B43/00 ,  H01L21/78 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/78 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/67098 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/10 ,  Y10T156/1121 ,  Y10T156/1126 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1911 ,  Y10T156/1922 ,  Y10T156/1939

Abstract: An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.