Invention Grant
US09196549B2 Method for generating die identification by measuring whether circuit is established in a package structure
有权
通过测量在封装结构中是否建立电路来产生管芯识别的方法
- Patent Title: Method for generating die identification by measuring whether circuit is established in a package structure
- Patent Title (中): 通过测量在封装结构中是否建立电路来产生管芯识别的方法
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Application No.: US14096022Application Date: 2013-12-04
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Publication No.: US09196549B2Publication Date: 2015-11-24
- Inventor: Kuang-Hui Tang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/768 ; H01L21/66 ; H01L23/00
Abstract:
A package structure is disclosed. The package structure includes a die; a substrate disposed corresponding to the die, wherein the substrate comprises a first dummy pad and a second dummy pad on a first surface of the substrate; and a first solder ball and a second solder ball on a second surface of the substrate and electrically connect the first dummy pad and the second dummy pad respectively.
Public/Granted literature
Information query
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