To peel an etching resist easily and reliably without damaging a transparent conductive layer coated with the etching resist. A method for manufacturing a transparent printed circuit in an embodiment of the present invention includes: providing a transparent conductive sheet 3 having a transparent base material 1 and a transparent conductive layer 2 formed on the transparent base material 1, forming an etching resist 4 having a specified pattern on the transparent conductive layer 2, etching the transparent conductive layer 2 with the etching resist 4 as a mask, forming a peeling film 5 on the etching resist 4 and on the transparent base material 1 exposed by etching of the transparent conductive layer 2 so as to cover an area where the etching resist 4 is formed, and peeling the peeling film 5 together with the etching resist 4.