Invention Grant
- Patent Title: Semiconductor chip structure
- Patent Title (中): 半导体芯片结构
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Application No.: US14271390Application Date: 2014-05-06
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Publication No.: US09202771B2Publication Date: 2015-12-01
- Inventor: Yi-Jyun Chen
- Applicant: LEXTAR ELECTRONICS CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: Lextar Electronics Corporation
- Current Assignee: Lextar Electronics Corporation
- Current Assignee Address: TW Hsinchu
- Priority: TW102135960A 20131004
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/38
Abstract:
A semiconductor chip structure including a semiconductor chip having a pair of electrodes is disclosed. The electrodes have different conductivity types for electrical connection, respectively. A thermoelectric cooling material layer is disposed within each of the pair of electrodes, respectively.
Public/Granted literature
- US20150097207A1 SEMICONDUCTOR CHIP STRUCTURE Public/Granted day:2015-04-09
Information query
IPC分类:
