A method of electroplating and depositing metal includes: providing an insulation substrate formed with conductive through holes; forming a first conductive layer on a first surface of the insulation substrate and forming a resist layer on a first portion of the first conductive layer, leaving a second portion of the first conductive layer uncovered by the resist layer as a to-be-plated area; disposing the insulation substrate in a first electroplating solution and depositing a first metal layer on the to-be-plated area; removing the resist layer and the portion of the first conductive layer; forming a second conductive layer on a second surface of the insulation substrate; forming a mask layer on the second conductive layer; disposing the insulation substrate in a second electroplating solution and depositing a second metal layer on the first metal layer of the to-be-plated area; and removing the mask layer and the second conductive layer.