Invention Grant
- Patent Title: Manufacturing method of semiconductor device and mounting jig
- Patent Title (中): 半导体器件和安装夹具的制造方法
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Application No.: US14204455Application Date: 2014-03-11
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Publication No.: US09204559B2Publication Date: 2015-12-01
- Inventor: Rikihiro Maruyama , Kenshi Kai , Nobuyuki Kanzawa , Mitsutoshi Sawano
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agent Manabu Kanesaka
- Priority: JP2013-060987 20130322
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K3/34 ; H05K3/40
Abstract:
A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.
Public/Granted literature
- US20140317896A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MOUNTING JIG Public/Granted day:2014-10-30
Information query
