Invention Grant
- Patent Title: High performance interconnect physical layer
- Patent Title (中): 高性能互连物理层
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Application No.: US14538937Application Date: 2014-11-12
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Publication No.: US09208121B2Publication Date: 2015-12-08
- Inventor: Venkatraman Iyer , Darren S. Jue , Robert G. Blankenship , Fulvio Spagna , Debendra Das Sharma , Jeffrey C. Swanson
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06N99/00
Abstract:
A periodic control window is embedded in a link layer data stream to be sent over a serial data link, where the control window is configured to provide physical layer information including information for use in initiating state transitions on the data link. The link layer data can be sent during a link transmitting state of the data link and the control window can interrupt the sending of flits. In one aspect, the information includes link width transition data indicating an attempt to change the number of active lanes on the link.
Public/Granted literature
- US20150067208A1 HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER Public/Granted day:2015-03-05
Information query
