Invention Grant
- Patent Title: Semiconductor integrated circuit device and method for producing the same
- Patent Title (中): 半导体集成电路装置及其制造方法
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Application No.: US14661734Application Date: 2015-03-18
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Publication No.: US09209189B2Publication Date: 2015-12-08
- Inventor: Misato Sakamoto , Yoshitake Kato , Youichi Yamamoto , Hitoshi Kasai , Satoshi Itou
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Womble Carlyle Sandridge & Rice PLLC
- Priority: JP2014-056185 20140319
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/31 ; H01L27/108 ; H01L49/02 ; H01L21/285 ; H01L21/321 ; H01L21/02

Abstract:
A capacitive element has improved electrical properties. The capacitive element is configured in a DRAM cell and has a lower electrode, a capacitive insulator film formed over the lower electrode, and an upper electrode formed over the capacitive insulator film. The upper electrode has a structure in which from the capacitive insulator film side of this electrode, a first upper electrode, a second upper electrode and a third upper electrode are stacked in turn. The third upper electrode is a tungsten film that may contain an impurity. Between the first and third upper electrodes, the second upper electrode is interposed which is a barrier film for preventing the possible impurity in the third upper electrode from diffusing into the capacitive insulator film.
Public/Granted literature
- US20150270271A1 Semiconductor Integrated Circuit Device and Method For Producing The Same Public/Granted day:2015-09-24
Information query
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