Invention Grant
US09209191B2 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same 有权
包括用于向硅衬底施加拉伸应力的栅电极的半导体器件及其制造方法

Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same
Abstract:
A gate insulating film and a gate electrode of non-single crystalline silicon for forming an nMOS transistor are provided on a silicon substrate. Using the gate electrode as a mask, n-type dopants having a relatively large mass number (70 or more) such as As ions or Sb ions are implanted, to form a source/drain region of the nMOS transistor, whereby the gate electrode is amorphized. Subsequently, a silicon oxide film is provided to cover the gate electrode, at a temperature which is less than the one at which recrystallization of the gate electrode occurs. Thereafter, thermal processing is performed at a temperature of about 1000° C., whereby high compressive residual stress is exerted on the gate electrode, and high tensile stress is applied to a channel region under the gate electrode. As a result, carrier mobility of the nMOS transistor is enhanced.
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