Invention Grant
- Patent Title: Method for fabricating flexible electrical devices
- Patent Title (中): 制造柔性电气装置的方法
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Application No.: US13912172Application Date: 2013-06-06
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Publication No.: US09209403B2Publication Date: 2015-12-08
- Inventor: Chi-Fu Tseng , Chyi-Ming Leu , Hsueh-Yi Liao , Yung-Lung Tseng
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu County
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH CENTER
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH CENTER
- Current Assignee Address: TW Hsinchu County
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Priority: TW98146298A 20091231
- Main IPC: H01L31/0392
- IPC: H01L31/0392 ; C08G73/10 ; H01L51/00 ; C08L79/08

Abstract:
A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A′ is an aromatic or aliphatic group, and 1≦n/m≦4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.
Public/Granted literature
- US20130267061A1 METHOD FOR FABRICATING FLEXIBLE ELECTRICAL DEVICES Public/Granted day:2013-10-10
Information query
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