Invention Grant
- Patent Title: Apparatus and method of forming an indium gallium zinc oxide layer
- Patent Title (中): 形成铟镓锌氧化物层的装置和方法
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Application No.: US14608080Application Date: 2015-01-28
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Publication No.: US09214340B2Publication Date: 2015-12-15
- Inventor: Shinichi Kurita , Srikanth V. Racherla , Suhail Anwar
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/16 ; H01L21/20 ; H01L21/36 ; H01L21/02 ; C23C16/44 ; C23C16/505 ; C23C16/50 ; C23C16/52 ; C23C16/24 ; H01L29/786

Abstract:
The embodiments of the disclosure may generally provide a method and apparatus for forming thin film transistor device that includes an indium gallium zinc oxide (IGZO) layer using a multi-component precursor gas. The embodiments of the disclosure may provide a plasma enhanced chemical vapor deposition system configured to form an IGZO layer on large area substrates. However, it should be understood that the disclosure has utility in other system configurations such other types of chemical vapor deposition systems and any other system in which distributing a multi-component precursor gas to and within a process chamber is desired.
Public/Granted literature
- US20150221508A1 APPARATUS AND METHOD OF FORMING AN INDIUM GALLIUM ZINC OXIDE LAYER Public/Granted day:2015-08-06
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