Invention Grant
- Patent Title: Chip package and method for forming the same
- Patent Title (中): 芯片封装及其形成方法
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Application No.: US13467814Application Date: 2012-05-09
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Publication No.: US09216898B2Publication Date: 2015-12-22
- Inventor: Chien-Hung Liu
- Applicant: Chien-Hung Liu
- Agency: Liu & Liu
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/40 ; B81B7/00 ; H01L21/78 ; H01L23/00 ; H01L25/065
Abstract:
An embodiment of the invention provides a chip package which includes: a first substrate; a second substrate disposed on the first substrate, wherein the second substrate has at least one opening penetrating through the second substrate, and the at least one opening defines a plurality of conducting regions electrically insulated from each other in the second substrate; a carrier substrate disposed on the second substrate; an insulating layer disposed on a surface and a sidewall of the carrier substrate, wherein the insulating layer fills the at least one opening of the second substrate; and a conducting layer disposed on the insulating layer on the carrier substrate and electrically contacting with one of the conducting regions.
Public/Granted literature
- US20120286420A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2012-11-15
Information query
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