A substrate position aligner includes a substrate holding assembly, a plurality of rollers, a rotation mechanism, and a sensor. The substrate holding assembly is configured to hold a substrate in a vertical orientation. The plurality of rollers include at least two idler rollers and a drive roller. Each roller has a point on its perimeter spaced on a common radius from a center of substrate rotation defined within the substrate holding assembly. The sensor is positioned approximately on the common radius and configured to detect the presence of an orientation cut in the substrate when the orientation cut is not orientated within a range between about −44 degrees and about +44 degrees from horizontal. A method of aligning a substrate having an orientation cut includes sensing a presence of the orientation cut when the orientation cut is not orientated within the above recited range.