Invention Grant
- Patent Title: System and method for heating plasma exposed surfaces
- Patent Title (中): 用于加热等离子体暴露表面的系统和方法
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Application No.: US13853915Application Date: 2013-03-29
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Publication No.: US09224583B2Publication Date: 2015-12-29
- Inventor: Henry Povolny , Rajinder Dhindsa
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla Group, LLP
- Main IPC: C23C16/50
- IPC: C23C16/50 ; C23C16/00 ; C23F1/00 ; H01L21/306 ; H01J37/32 ; C23C16/46 ; C23C16/458

Abstract:
A substrate support apparatus for a plasma processing system includes a layer of dielectric material having a top surface and a bottom surface. The top surface is defined to support a substrate in exposure to a plasma. The substrate support apparatus also includes a number of optical fibers each having a first end and a second end. The first end of each optical fiber is defined to receive photons from a photon source. The second end of each optical fiber is oriented to project photons received from the photon source onto the bottom surface of the layer of dielectric material.
Public/Granted literature
- US20140263177A1 System and Method for Heating Plasma Exposed Surfaces Public/Granted day:2014-09-18
Information query
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