Invention Grant
- Patent Title: Bio-implantable hermetic integrated ultra high density device
- Patent Title (中): 生物植入式气密集成超高密度装置
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Application No.: US13490189Application Date: 2012-06-06
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Publication No.: US09224664B2Publication Date: 2015-12-29
- Inventor: Brian R. Smith , Tirunelveli S. Sriram , Bryan L. McLaughlin
- Applicant: Brian R. Smith , Tirunelveli S. Sriram , Bryan L. McLaughlin
- Applicant Address: US MA Cambridge
- Assignee: The Charles Stark Draper Laboratory, Inc.
- Current Assignee: The Charles Stark Draper Laboratory, Inc.
- Current Assignee Address: US MA Cambridge
- Agency: Foley & Lardner LLP
- Agent Edward A. Gordon
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L23/13 ; H01L23/31 ; H01L21/56 ; H01L23/00 ; A61N1/372 ; A61N1/375 ; A61N1/362
Abstract:
An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.
Public/Granted literature
- US20130329373A1 BIO-IMPLANTABLE HERMETIC INTEGRATED ULTRA HIGH DENSITY DEVICE Public/Granted day:2013-12-12
Information query
