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公开(公告)号:US09224664B2
公开(公告)日:2015-12-29
申请号:US13490189
申请日:2012-06-06
IPC分类号: H05K7/00 , H01L23/13 , H01L23/31 , H01L21/56 , H01L23/00 , A61N1/372 , A61N1/375 , A61N1/362
CPC分类号: H01L21/56 , A61N1/362 , A61N1/37205 , A61N1/3756 , H01L21/76895 , H01L23/13 , H01L23/3121 , H01L24/24 , H01L24/25 , H01L24/97 , H01L2223/6677 , H01L2224/24137 , H01L2224/2518 , H01L2224/94 , H01L2224/97 , H01L2924/1461 , Y10T29/49146 , H01L2224/82 , H01L2924/00
摘要: An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.
摘要翻译: 本文公开了可植入生物相容的集成电路器件及其制造方法。 该装置包括具有凹部的基板。 包括至少一个生物相容的电触头的输入/输出装置在凹部中耦合到基板。 一层密封的生物相容的气密绝缘体材料沉积在输入/输出装置的一部分上。 生物相容性材料的封装层封装了可植入装置的至少一部分,包括输入/输出装置。 然后暴露输入/输出装置的至少一个生物相容的电触点。 封装层和生物相容的密封绝缘体材料层围绕至少一个暴露的生物相容的电触头形成气密密封。
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公开(公告)号:US20130329373A1
公开(公告)日:2013-12-12
申请号:US13490189
申请日:2012-06-06
CPC分类号: H01L21/56 , A61N1/362 , A61N1/37205 , A61N1/3756 , H01L21/76895 , H01L23/13 , H01L23/3121 , H01L24/24 , H01L24/25 , H01L24/97 , H01L2223/6677 , H01L2224/24137 , H01L2224/2518 , H01L2224/94 , H01L2224/97 , H01L2924/1461 , Y10T29/49146 , H01L2224/82 , H01L2924/00
摘要: An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.
摘要翻译: 本文公开了可植入生物相容的集成电路器件及其制造方法。 该装置包括具有凹部的基板。 包括至少一个生物相容的电触头的输入/输出装置在凹部中耦合到基板。 一层密封的生物相容的气密绝缘体材料沉积在输入/输出装置的一部分上。 生物相容性材料的封装层封装了可植入装置的至少一部分,包括输入/输出装置。 然后暴露输入/输出装置的至少一个生物相容的电触点。 封装层和生物相容的密封绝缘体材料层围绕至少一个暴露的生物相容的电触头形成气密密封。
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公开(公告)号:US07773217B2
公开(公告)日:2010-08-10
申请号:US11357899
申请日:2006-02-17
IPC分类号: G01J3/44
CPC分类号: G01N21/65 , G01J3/02 , G01J3/0224 , G01J3/0291 , G01J3/10 , G01J3/26 , G01J3/28 , G01J3/44
摘要: A probe of a Raman spectroscopy system has a wavelength and/or amplitude referencing system for determining a wavelength of the excitation signal. Preferably, this referencing system is near an output aperture, through which the excitation signal is transmitted to the sample. In this way, any birefringence or polarization dependent loss (PDL) that may be introduced by optical elements in the system can be compensated for since the wavelength reference system will detect the effect or impact of these elements.
摘要翻译: 拉曼光谱系统的探针具有用于确定激发信号的波长的波长和/或幅度参考系统。 优选地,该参考系统靠近输出孔径,通过该输出孔径将激发信号传输到样品。 以这种方式,可以补偿由系统中的光学元件引入的任何双折射或偏振相关损耗(PDL),因为波长参考系将检测这些元件的影响或影响。
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公开(公告)号:US6096637A
公开(公告)日:2000-08-01
申请号:US124198
申请日:1998-07-28
IPC分类号: H01L21/768 , H01L23/522 , H01L21/4763
CPC分类号: H01L21/76864 , H01L21/76843 , H01L21/76858 , H01L23/5226 , H01L2924/0002
摘要: A method is described for forming an electromigration-resistant (ER) intermetallic region beneath and adjacent a conductive plug in a via. Preferably the ER region is formed of a sintered intermetallic compound of Al and Ti, and the conductive plug is formed of W.
摘要翻译: 描述了一种用于在通孔中的导电插塞下方和邻近形成电迁移(ER)金属间区域的方法。 优选地,ER区域由Al和Ti的烧结金属间化合物形成,并且导电塞由W.
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公开(公告)号:US20180264687A1
公开(公告)日:2018-09-20
申请号:US15534918
申请日:2015-12-09
申请人: David J. CARTER , Tirunelveli S. SRIRAM , Parshant KUMAR , Clayton MORRIS , William W. MCFARLAND , Eugene H. COOK , John LE BLANC , Alla EPSHTEYN , W. Dennis SLAFER , B. Diane MARTIN , THE CHARLES STARK DRAPER LABORATORY, INC. , MICROCONTINUUM, INC.
发明人: David J. Carter , Tirunelveli S. Sriram , Parshant Kumar , Clayton Morris , William W. McFarland , Eugene H. Cook , John LeBlanc , Alla Epshteyn , W. Dennis Slafer , B. Diane Martin
CPC分类号: B29C33/307 , B23P15/00 , B23P15/24 , B29C33/3842 , B29C33/42 , B29C33/424 , B29C33/68 , B29C39/026 , B29K2905/00 , B81C99/0085 , C25D1/00 , C25D1/10 , C25D1/22 , C25D5/34
摘要: A method of forming a metal mold for casting a micro-scale dry adhesive structure includes securing a master patch of material including a micro-scale dry adhesive structure on a plating fixture, electroforming the metal mold on the patch of material, and removing the metal mold from the plating fixture and patch of material.
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