Invention Grant
- Patent Title: Nitride semiconductor device and fabricating method thereof
- Patent Title (中): 氮化物半导体器件及其制造方法
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Application No.: US14251717Application Date: 2014-04-14
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Publication No.: US09224846B2Publication Date: 2015-12-29
- Inventor: Jonghoon Shin , Woongsun Kim , Taehoon Jang
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2013-0041813 20130416
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L29/778 ; H01L29/66 ; H01L21/02 ; H01L29/20

Abstract:
This specification relates to an enhancement-type semiconductor device having a passivation layer formed using a photoelectrochemical (PEC) method, and a fabricating method thereof.To this end, a semiconductor device according to one exemplary embodiment includes a GaN layer, an AlGaN layer formed on the GaN layer, a p-GaN layer formed on the AlGaN layer, a gate electrode formed on the p-GaN layer, a source electrode and a drain electrode formed on a partial region of the AlGaN layer, and a passivation layer formed on a partial region of the AlGaN layer, the passivation layer formed between the source electrode and the gate electrode or between the gate electrode and the drain electrode, wherein the passivation layer is formed in a manner of oxidizing a part of the p-GaN layer.
Public/Granted literature
- US20140306181A1 NITRIDE SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF Public/Granted day:2014-10-16
Information query
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