Invention Grant
- Patent Title: Transmitting magnetic field through metal chassis using fractal surfaces
- Patent Title (中): 使用分形表面通过金属底盘传输磁场
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Application No.: US13678926Application Date: 2012-11-16
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Publication No.: US09225388B2Publication Date: 2015-12-29
- Inventor: Anand S. Konanur , Ulun Karacaoglu , Songnan Yang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Forefront IP Lawgroup, PLLC
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H01Q1/22 ; H01Q1/52 ; H01Q7/00

Abstract:
Described herein are techniques related one or more systems, apparatuses, methods, etc. for reducing induced currents in a apparatus chassis. For example, a fractal slot is constructed in the apparatus chassis to reduce the induced currents, and enhance passage of magnetic fields through the apparatus chassis. In this example, the fractal slot may include a no-self loop fractal space filling curve shape to provide high impedance to the induced currents.
Public/Granted literature
- US20140011447A1 TRANSMITTING MAGNETIC FIELD THROUGH METAL CHASSIS USING FRACTAL SURFACES Public/Granted day:2014-01-09
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