Invention Grant
- Patent Title: Embedded control channel for high speed serial interconnect
- Patent Title (中): 用于高速串行互连的嵌入式控制通道
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Application No.: US13537837Application Date: 2012-06-29
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Publication No.: US09229897B2Publication Date: 2016-01-05
- Inventor: Venkatraman Iyer , Debendra Das Sharma , Robert G. Blankenship , Darren S. Jue
- Applicant: Venkatraman Iyer , Debendra Das Sharma , Robert G. Blankenship , Darren S. Jue
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Law Office of R. Alan Burnett, P.S.
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42

Abstract:
Methods and apparatus for embedding a control channel in a high speed serial interconnect having multiple data lanes. Operational aspects of the interconnect are controlled via use of control channel data that is sent over one or more of the data lanes on a periodic basis. A link state cycle is employed that includes a link control period during which control information is transferred over the interconnect and a link control interval between link control periods during which other links states are implemented, such as for transferring data or operating the link in a low power state. The link state cycles at transmitter and receiver ports are synchronized to account for link transmit latencies, and the timing of link state cycles corresponding to a bidirectional exchange of link control information may be configured to support an overlapping implementation or to facilitate a request/response link control protocol.
Public/Granted literature
- US20140006677A1 EMBEDDED CONTROL CHANNEL FOR HIGH SPEED SERIAL INTERCONNECT Public/Granted day:2014-01-02
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