Invention Grant
- Patent Title: Temperature compensation for oscillator
- Patent Title (中): 振荡器温度补偿
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Application No.: US13976942Application Date: 2012-03-13
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Publication No.: US09231519B2Publication Date: 2016-01-05
- Inventor: Fangxing Wei , Yongping Fan
- Applicant: Fangxing Wei , Yongping Fan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe Williamson & Wyatt PC
- International Application: PCT/US2012/028955 WO 20120313
- International Announcement: WO2013/137867 WO 20130919
- Main IPC: H03L1/00
- IPC: H03L1/00 ; H03B5/04 ; H03B5/12

Abstract:
A temperature compensation apparatus may include a sense circuit configured to produce a sense voltage that is dependent on temperature and a temperature compensation circuit configured to receive the sense voltage and produce a temperature compensation control signal to control a compensation capacitor array of an oscillator. The temperature compensation circuit may be configured to calibrate the control signal to have a first value at a first temperature. The temperature compensation circuit may also be configured to calibrate a trimming level (e.g., slope) of the control signal.
Public/Granted literature
- US20140218123A1 TEMPERATURE COMPENSATION FOR OSCILLATOR Public/Granted day:2014-08-07
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