Invention Grant
- Patent Title: Multi-chip socket
- Patent Title (中): 多芯片插座
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Application No.: US14323619Application Date: 2014-07-03
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Publication No.: US09232681B2Publication Date: 2016-01-05
- Inventor: Kevin B. Leigh , George D. Megason
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R43/20 ; H05K7/20 ; H05K7/10 ; H01L23/13 ; H01L23/32 ; H01L23/36 ; H05K3/32
Abstract:
A multi-chip socket includes a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip. A second cavity has a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip. The first support surface is in a first plane, and the second support surface is in a second plane, where the first plane is angled with respect to the second plane.
Public/Granted literature
- US20140315435A1 MULTI-CHIP SOCKET Public/Granted day:2014-10-23
Information query
