发明授权
US09235082B2 Light emitting diode package, method of fabricating the same, and display apparatus having the same
有权
发光二极管封装,其制造方法以及具有该发光二极管封装的显示装置
- 专利标题: Light emitting diode package, method of fabricating the same, and display apparatus having the same
- 专利标题(中): 发光二极管封装,其制造方法以及具有该发光二极管封装的显示装置
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申请号: US13231816申请日: 2011-09-13
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公开(公告)号: US09235082B2公开(公告)日: 2016-01-12
- 发明人: Myeong-Ju Shin , Jaewoo Jung , YoungSic Kim , Seung Hwan Baek , Yeongbae Lee
- 申请人: Myeong-Ju Shin , Jaewoo Jung , YoungSic Kim , Seung Hwan Baek , Yeongbae Lee
- 申请人地址: KR
- 专利权人: SAMSUNG DISPLAY CO., LTD.
- 当前专利权人: SAMSUNG DISPLAY CO., LTD.
- 当前专利权人地址: KR
- 代理机构: Innovation Counsel LLP
- 优先权: KR10-2011-0029801 20110331
- 主分类号: F21V7/04
- IPC分类号: F21V7/04 ; G02F1/1335 ; H01L33/44 ; H01L33/50
摘要:
A light emitting diode package, a method of fabricating the same, and a display apparatus having the same are provided. The light emitting diode package includes a light emitting diode, a quantum dot layer, a band pass filter, disposed in a housing. The light emitting diode emits light of a first color. The quantum dot layer includes a plurality of quantum dots disposed on the light emitting diode to absorb a portion of the light emitted by the diode, and then emit light of a second color. The band pass filter is disposed on the quantum dot layer and has a first pass band corresponding to the light emitted from the diode and a second pass band corresponding to the light emitted from the quantum dots.
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