Invention Grant
- Patent Title: Integrated circuit package with thermal neutron shielding
- Patent Title (中): 具有热中子屏蔽的集成电路封装
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Application No.: US14257853Application Date: 2014-04-21
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Publication No.: US09236354B2Publication Date: 2016-01-12
- Inventor: Pierre Maillard , Jeffrey Barton , Austin H. Lesea
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent LeRoy D. Maunu
- Main IPC: H01L23/552
- IPC: H01L23/552
Abstract:
A semiconductor package with thermal neutron shielding is disclosed. The semiconductor package includes a substrate and an integrated circuit die disposed on the substrate. The semiconductor package also has a thermal neutron shield including a shielding material. The shielding material includes boron-10 and is configured to inhibit a portion of thermal neutrons that encounter the thermal neutron shield from passing through the thermal neutron shield.
Public/Granted literature
- US20150348915A1 INTEGRATED CIRCUIT PACKAGE WITH THERMAL NEUTRON SHIELDING Public/Granted day:2015-12-03
Information query
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