公开(公告)号：US09236354B2

公开(公告)日：2016-01-12

申请号：US14257853

申请日：2014-04-21

Applicant: Xilinx, Inc.

Inventor： Pierre Maillard ,  Jeffrey Barton ,  Austin H. Lesea

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L21/563 ,  H01L23/3128 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00

Abstract: A semiconductor package with thermal neutron shielding is disclosed. The semiconductor package includes a substrate and an integrated circuit die disposed on the substrate. The semiconductor package also has a thermal neutron shield including a shielding material. The shielding material includes boron-10 and is configured to inhibit a portion of thermal neutrons that encounter the thermal neutron shield from passing through the thermal neutron shield.

Abstract translation: 公开了一种具有热中子屏蔽的半导体封装。 半导体封装包括衬底和设置在衬底上的集成电路管芯。 半导体封装还具有包括屏蔽材料的热中子屏蔽。 屏蔽材料包括硼-10并且被配置为抑制遇到热中子屏蔽的热中子的一部分通过热中子屏蔽。

公开(公告)号：US20150348915A1

公开(公告)日：2015-12-03

申请号：US14257853

申请日：2014-04-21

Applicant: Xilinx, Inc.

Inventor： Pierre Maillard ,  Jeffrey Barton ,  Austin H. Lesea

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L21/563 ,  H01L23/3128 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00

Abstract: A semiconductor package with thermal neutron shielding is disclosed. The semiconductor package includes a substrate and an integrated circuit die disposed on the substrate. The semiconductor package also has a thermal neutron shield including a shielding material. The shielding material includes boron-10 and is configured to inhibit a portion of thermal neutrons that encounter the thermal neutron shield from passing through the thermal neutron shield.

Abstract translation: 公开了一种具有热中子屏蔽的半导体封装。 半导体封装包括衬底和设置在衬底上的集成电路管芯。 半导体封装还具有包括屏蔽材料的热中子屏蔽。 屏蔽材料包括硼-10并且被配置为抑制遇到热中子屏蔽的热中子的一部分通过热中子屏蔽。