In some embodiments, a semiconductor device package assembly may include a first substrate. The first substrate may include a first set of electrical conductors which electrically connect the assembly. In some embodiments, the assembly may include at least one electrical conductor coupled to the first substrate such that at least one of the electrical conductors exposes through a perimeter surface of the semiconductor device package assembly. In some embodiments, the assembly may include a first die electrically connected to a second surface of the first substrate using a second set of electrical conductors. The assembly may include an electronic memory module coupled to the first die. In some embodiments, the assembly may include a shield applied to an upper surface of the assembly and electrically coupled to at least one of the exposed electrical conductors. The shield may inhibit, during use, electromagnetic interference.