Invention Grant
- Patent Title: Heat-dissipating device and method for manufacturing the same
- Patent Title (中): 散热装置及其制造方法
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Application No.: US13610501Application Date: 2012-09-11
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Publication No.: US09238262B2Publication Date: 2016-01-19
- Inventor: Sheng-Huang Lin , Kuo-Sheng Lin
- Applicant: Sheng-Huang Lin , Kuo-Sheng Lin
- Applicant Address: TW New Taipei
- Assignee: Asia Vital Components Co., Ltd.
- Current Assignee: Asia Vital Components Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Nikolai & Mersereau, P.A.
- Agent C. G. Mersereau
- Priority: TW101127727A 20120801
- Main IPC: F21V29/77
- IPC: F21V29/77 ; B21D53/06 ; B21D53/02 ; F28D21/00

Abstract:
The present invention relates to a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a base and a first heat-dissipating fin. The outer periphery of the base has a trough. The first heat-dissipating fin has a first heat-dissipating portion, a first end and a second end. The first end and the second end are disposed in the trough. By a machining process, both ends of the first heat-dissipating fin are pressed into the trough of the base at a high speed, so that the base can be combined with the first heat-dissipating fin rapidly. In this way, the manufacture cost is reduced and the heat-dissipating efficiency is increased.
Public/Granted literature
- US20140034280A1 HEAT-DISSIPATING DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-02-06
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