Invention Grant
US09238317B2 Lighting apparatus, LED mounting substrate and mold for manufacturing the same
有权
照明装置,LED安装基板及其制造用模具
- Patent Title: Lighting apparatus, LED mounting substrate and mold for manufacturing the same
- Patent Title (中): 照明装置,LED安装基板及其制造用模具
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Application No.: US14156583Application Date: 2014-01-16
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Publication No.: US09238317B2Publication Date: 2016-01-19
- Inventor: Shing-Kuo Chen , Bo-Yu Ko , Hsiu-Hsiang Lin
- Applicant: Lextar Electronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Lextar Electronics Corporation
- Current Assignee: Lextar Electronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Hayes Soloway PC
- Priority: TW102101775A 20130117
- Main IPC: B29C45/02
- IPC: B29C45/02 ; H01L33/48 ; H01L33/62 ; B29C45/14 ; H01L33/60

Abstract:
An LED mounting substrate includes a lead frame, a base, and a residue of injection molding material. The base is placed on the lead frame, and includes a cavity. The bottom of the cavity includes an opening for exposing portion of the lead frame. The cross-sectional area of the cavity increases along the direction from the lead frame to the top surface of the base. The residue of injection molding material is remained on one of outer walls of the base surrounding the cavity. The cross-sectional area of the residue of injection molding material decreases along the direction from the lead frame to the top surface of the base.
Public/Granted literature
- US20140197446A1 Lighting Apparatus, LED Mounting Substrate and Mold for Manufacturing the Same Public/Granted day:2014-07-17
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