Invention Grant
US09245661B2 Conductive film with doped layers, method for producing the same, and array substrate comprising the same
有权
具有掺杂层的导电膜,其制造方法和包括该导电膜的阵列基板
- Patent Title: Conductive film with doped layers, method for producing the same, and array substrate comprising the same
- Patent Title (中): 具有掺杂层的导电膜,其制造方法和包括该导电膜的阵列基板
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Application No.: US14313502Application Date: 2014-06-24
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Publication No.: US09245661B2Publication Date: 2016-01-26
- Inventor: Bin Zhang , Zhengliang Li , Zhen Liu , Luke Ding , Zhanfeng Cao , Guanbao Hui
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Kinney & Lange, P.A.
- Priority: CN201410067432 20140226
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01B1/02 ; B32B15/01 ; H01L27/12 ; H01L21/285

Abstract:
A conductive film, a method for producing the same and an array substrate comprising the same are provided, so that copper atoms can be efficiently prevented from diffusing into an adjacent semiconductor layer or interlaminated insulation film. The conductive film comprises a base film made of copper or copper alloy, in which hydrogen and/or carbon atoms are distributed.
Public/Granted literature
- US20150243399A1 CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME AND ARRAY SUBSTRATE COMPRISING THE SAME Public/Granted day:2015-08-27
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