Invention Grant
US09245865B1 Integrated circuit package with multi-trench structure on flipped substrate contacting underfill
有权
集成电路封装，具有多沟槽结构，翻转衬底接触底部填充物
- Patent Title: Integrated circuit package with multi-trench structure on flipped substrate contacting underfill
- Patent Title (中): 集成电路封装，具有多沟槽结构，翻转衬底接触底部填充物
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Application No.: US14571173Application Date: 2014-12-15
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Publication No.: US09245865B1Publication Date: 2016-01-26
- Inventor: Woon-Seong Kwon , Suresh Ramalingam
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent Keith Taboada
- Main IPC: H01L31/12
- IPC: H01L31/12 ; H01L21/50 ; H01L23/00 ; H01L21/56 ; H01L23/31 ; H01L23/498
Abstract:
In an example, an integrated circuit (IC) package includes a package substrate, an IC die, solder bumps, a first plurality of trenches, and underfill material. The IC die includes a front surface and a back surface, the front surface facing the package substrate and including a conductive interface. The solder bumps couple the conductive interface to the package substrate. The first plurality of trenches includes at least one trench proximate each corner of the IC die formed in the front surface of the IC die in an area between the conductive interface and a perimeter of the IC die. The underfill material is disposed between the front surface of the IC die and the package substrate, the underfill material being in contact with the first plurality of trenches.
Information query
IPC分类:
