Invention Grant
US09245940B2 Inductor design on floating UBM balls for wafer level package (WLP)
有权
用于晶圆级封装（WLP）的浮动UBM球的电感设计
- Patent Title: Inductor design on floating UBM balls for wafer level package (WLP)
- Patent Title (中): 用于晶圆级封装（WLP）的浮动UBM球的电感设计
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Application No.: US14179202Application Date: 2014-02-12
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Publication No.: US09245940B2Publication Date: 2016-01-26
- Inventor: Young Kyu Song , Yunseo Park , Xiaonan Zhang , Ryan David Lane , Aristotele Hadjichristos
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L27/08
- IPC: H01L27/08 ; H01L49/02 ; H01L23/00 ; H01L23/522
Abstract:
An inductor design on a wafer level package (WLP) does not need to depopulate the solder balls on the die because the solder balls form part of the inductor. One terminal on the inductor couples to the die, the other terminal couples to a single solder ball on the die, and the remaining solder balls that mechanically contact the inductor remain electrically floating. The resulting device has better inductance, direct current (DC) resistance, board-level reliability (BLR), and quality factor (Q).
Public/Granted literature
- US20150228707A1 INDUCTOR DESIGN ON FLOATING UBM BALLS FOR WAFER LEVEL PACKAGE (WLP) Public/Granted day:2015-08-13
Information query
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