Invention Grant
- Patent Title: Method for making conductive wires
- Patent Title (中): 制作导线的方法
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Application No.: US12589459Application Date: 2009-10-22
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Publication No.: US09247650B2Publication Date: 2016-01-26
- Inventor: Yao-Wen Bai , Rui Zhang , Cheng-Hsien Lin
- Applicant: Yao-Wen Bai , Rui Zhang , Cheng-Hsien Lin
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: Tsinghua University,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Beijing TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN200810218193 20081212
- Main IPC: H05K3/24
- IPC: H05K3/24 ; C23C18/18 ; B82Y10/00 ; H05K3/12
Abstract:
A method for making conductive wires is provided. Firstly, an ink having carbon nanotubes is provided. Secondly, a baseline is formed using the ink on a substrate. Thirdly, the baseline is electroless plated.
Public/Granted literature
- US20100151120A1 Method for making conductive wires Public/Granted day:2010-06-17
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