Application of fluids to substrates

Invention Grant

US09248466B2 Application of fluids to substrates 有权

Title translation: 流体应用于基材

Patent Title: Application of fluids to substrates
Patent Title (中): 流体应用于基材
Application No.: US13891644

Application Date: 2013-05-10
Publication No.: US09248466B2

Publication Date: 2016-02-02
Inventor: Karl Pilch , Hans Leitner , Michael Kalin
Applicant: Infineon Technologies AG
Applicant Address: DE Neubiberg
Assignee: Infineon Technologies AG
Current Assignee: Infineon Technologies AG
Current Assignee Address: DE Neubiberg
Agency: Slater & Matsil, L.L.P.
Main IPC: H01L21/00
IPC: H01L21/00 ; B05C11/02 ; B05D1/00 ; B05D3/00 ; H01L21/02 ; H01L21/67 ; H01L21/683

Abstract:

Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract(Chinese):

各种实施例涉及将流体施加到基底。例如，将流体局部加热以获得所需的厚度分布。

Public/Granted literature

Information query

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备