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公开(公告)号：US09248466B2
公开(公告)日：2016-02-02
申请号：US13891644
申请日：2013-05-10
发明人： Karl Pilch , Hans Leitner , Michael Kalin
CPC分类号： B05B12/02 , B05B13/02 , B05C11/02 , B05D1/002 , B05D3/007 , H01L21/02282 , H01L21/67109 , H01L21/6715 , H01L21/6835 , H01L2221/68327 , Y10T156/10
摘要： Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.
摘要翻译： 各种实施例涉及将流体施加到基底。 例如，将流体局部加热以获得所需的厚度分布。
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公开(公告)号：US20140335699A1
公开(公告)日：2014-11-13
申请号：US13891644
申请日：2013-05-10
发明人： Karl Pilch , Hans Leitner , Michael Kalin
CPC分类号： B05B12/02 , B05B13/02 , B05C11/02 , B05D1/002 , B05D3/007 , H01L21/02282 , H01L21/67109 , H01L21/6715 , H01L21/6835 , H01L2221/68327 , Y10T156/10
摘要： Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.
摘要翻译： 各种实施例涉及将流体施加到基底。 例如，将流体局部加热以获得所需的厚度分布。
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公开(公告)号：US09433962B2
公开(公告)日：2016-09-06
申请号：US14978507
申请日：2015-12-22
发明人： Karl Pilch , Hans Leitner , Michael Kalin
IPC分类号： H01L21/00 , B05B12/02 , B05C11/02 , B05D1/00 , B05D3/00 , H01L21/02 , H01L21/67 , H01L21/683 , B05B13/02
CPC分类号： B05B12/02 , B05B13/02 , B05C11/02 , B05D1/002 , B05D3/007 , H01L21/02282 , H01L21/67109 , H01L21/6715 , H01L21/6835 , H01L2221/68327 , Y10T156/10
摘要： Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.
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公开(公告)号：US20160107183A1
公开(公告)日：2016-04-21
申请号：US14978507
申请日：2015-12-22
发明人： Karl Pilch , Hans Leitner , Michael Kalin
CPC分类号： B05B12/02 , B05B13/02 , B05C11/02 , B05D1/002 , B05D3/007 , H01L21/02282 , H01L21/67109 , H01L21/6715 , H01L21/6835 , H01L2221/68327 , Y10T156/10
摘要： Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.
摘要翻译： 各种实施例涉及将流体施加到基底。 例如，将流体局部加热以获得所需的厚度分布。
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