发明授权
- 专利标题： Substrate, method of fabricating the same, and application the same
- 专利标题（中）： 基板，制造方法及其应用
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申请号： US14472391申请日： 2014-08-29
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公开(公告)号： US09252079B2公开(公告)日： 2016-02-02
- 发明人: Yao-Jun Tsai , Chen-Peng Hsu , Shih-Yi Wen , Chi-Chin Yang , Hung-Lieh Hu
- 申请人： Industrial Technology Research Institute
- 申请人地址： TW Hsinchu
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 当前专利权人地址： TW Hsinchu
- 代理机构： Jianq Chyun IP Office
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L29/00 ; H01L23/48 ; H01L21/306 ; H01L27/02 ; H01L33/20 ; H01L33/62 ; H01L21/768 ; H01L23/00 ; H01S5/02 ; H01S5/024 ; H01S5/026 ; H01S5/34 ; G02B6/12 ; G02B6/34 ; H01L29/861 ; H01L23/60 ; H01L25/16
摘要：
Provided is a substrate, including a substrate material, two conductive structures, and at least one diode. The two conductive structures extend from a first surface of the substrate material to a second surface of the substrate material via two through holes penetrating through the substrate material. The at least one diode is embedded in the substrate material at a sidewall of one of the through holes.
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