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1.发明授权公开(公告)号：US10739607B2
公开(公告)日：2020-08-11
申请号：US16172882
申请日：2018-10-29
发明人： Hsueh-Chih Chang , Mu-Tao Chu , Hung-Lieh Hu , Jui-Ying Lin
摘要： A light source module adapted to provide a superposition structured pattern includes a light emitting device adapted to provide a light beam, a light guiding element including a polarizing beam splitter to separate the light beam into a first light beam and a second light beam, a first diffractive element configured to convert the first light beam into a first structured light, and a second diffractive element configured to convert the second light beam into a second structured light. Polarization states of the first light beam and the second light beam are different. The first and second structured lights are projected into a projection region, and overlapped and imaged as a superposition structured pattern. The projection region has sub-projection regions arranged in a matrix and adjacent to each other, and the pattern distribution of the superposition structured pattern in each sub-projection region is different from each other.
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公开(公告)号：US20130235578A1
公开(公告)日：2013-09-12
申请号：US13832047
申请日：2013-03-15
发明人： Chia-Fen Hsieh , Chen-Kun Chen , Yu-Chen Yu , Hung-Lieh Hu , Mu-Tao Chu
IPC分类号： F21V29/00
CPC分类号： F21K9/232 , F21K9/90 , F21V29/713 , F21V29/773 , F21V29/777 , F21V29/83 , F21Y2107/30 , F21Y2115/10
摘要： An illumination device including a base and a heat dissipation member is provided. The heat dissipation member disposed on the base has a central axis and at least one heat dissipation channel. At least one virtual circle having a radius R1 with reference to the central axis is formed on an orthogonal virtual plane of the central axis, and at least one intersection is generated by the virtual circle and border of the heat dissipation channel.
摘要翻译： 提供一种包括基座和散热构件的照明装置。 设置在基座上的散热构件具有中心轴线和至少一个散热通道。 在中心轴的正交虚拟平面上形成至少一个具有相对于中心轴的半径R1的虚拟圆，并且由散热通道的虚拟圆和边界产生至少一个交点。
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公开(公告)号：US09391239B2
公开(公告)日：2016-07-12
申请号：US14166864
申请日：2014-01-29
发明人： Yao-Jun Tsai , Chen-Peng Hsu , Shih-Yi Wen , Chi-Chin Yang , Yu-Hsiang Chang , Re-Ching Lin , Hung-Lieh Hu
CPC分类号： H01L33/405 , H01L33/20 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The first semiconductor layer has a first surface and a second surface opposite to each other and has a first region and a second region. The second semiconductor layer is disposed on the second surface. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The substrate has a first conductive layer and a second conductive layer thereon. The first electrode is disposed between the second semiconductor layer and the first conductive layer. The second electrode is disposed on the first surface. The third electrode is disposed between the second region and the second conductive layer, and electrically connected to the second electrode.
摘要翻译： 发光二极管包括半导体层叠结构，基板，第一电极，第二电极和第三电极。 半导体堆叠结构包括第一半导体层，第二半导体层和发光层。 第一半导体层具有彼此相对的第一表面和第二表面，并且具有第一区域和第二区域。 第二半导体层设置在第二表面上。 发光层设置在第一半导体层和第二半导体层之间。 衬底上具有第一导电层和第二导电层。 第一电极设置在第二半导体层和第一导电层之间。 第二电极设置在第一表面上。 第三电极设置在第二区域和第二导电层之间，并且电连接到第二电极。
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公开(公告)号：US09231168B2
公开(公告)日：2016-01-05
申请号：US14267919
申请日：2014-05-02
发明人： Re-Ching Lin , Shih-Yi Wen , Chen-Peng Hsu , Hung-Lieh Hu , Yu-Chen Yu , Chia-Fen Hsieh
CPC分类号： H01L33/501
摘要： A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.
摘要翻译： 提供了包括芯片载体部分，发光二极管芯片和封装材料的发光二极管封装结构。 发光二极管芯片设置在封装的芯片载体部分上。 封装材料填充在芯片载体部分中并覆盖发光二极管芯片。 包装材料包括基质材料，多个第一粉末颗粒和多个第二粉末颗粒。 第一粉末颗粒和第二粉末颗粒分布在基质材料中。 每个第一粉末颗粒是波长转换材料。 每个第二粉末颗粒具有壳状结构。
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公开(公告)号：US20140184088A1
公开(公告)日：2014-07-03
申请号：US13864235
申请日：2013-04-16
发明人： Chien-Chun Lu , Chun-Hsing Lee , Ya-Hui Chiang , Hung-Lieh Hu , Chia-Fen Hsieh
IPC分类号： H05B33/08
CPC分类号： H05B33/0863
摘要： A light source apparatus includes a light-emitting module and a control unit. The light-emitting module is for providing a light. The control unit switches the light emitted from the light-emitting module between a first light and a second light, wherein the circadian stimulus value (CS/P value) of the second light is less than CS/P value of the first light, and the color temperatures of the second light and the first light are substantially the same as each other.
摘要翻译： 光源装置包括发光模块和控制单元。 发光模块用于提供光。 控制单元将从发光模块发射的光在第一光和第二光之间切换，其中第二光的昼夜刺激值（CS / P值）小于第一光的CS / P值，以及 第二光和第一光的色温基本上彼此相同。
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6.发明申请公开(公告)号：US20190293954A1
公开(公告)日：2019-09-26
申请号：US16172882
申请日：2018-10-29
发明人： Jui-Ying Lin , Hsueh-Chih Chang , Mu-Tao Chu , Hung-Lieh Hu
摘要： A light source module adapted to provide a superposition structured pattern includes a light emitting device adapted to provide a light beam, a light guiding element including a polarizing beam splitter to separate the light beam into a first light beam and a second light beam, a first diffractive element configured to convert the first light beam into a first structured light, and a second diffractive element configured to convert the second light beam into a second structured light. Polarization states of the first light beam and the second light beam are different. The first and second structured lights are projected into a projection region, and overlapped and imaged as a superposition structured pattern. The projection region has sub-projection regions arranged in a matrix and adjacent to each other, and the pattern distribution of the superposition structured pattern in each sub-projection region is different from each other.
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公开(公告)号：US20150098240A1
公开(公告)日：2015-04-09
申请号：US14049192
申请日：2013-10-08
发明人： Hsueh-Chih Chang , Hung-Lieh Hu , Chao-Wei Li
IPC分类号： F21V8/00
CPC分类号： G02B6/0006 , G02B6/0008 , G02B6/4214
摘要： A light source module optically coupled to an optical fiber which has a light incident surface is provided. The light source module includes a plurality of light sources and a concentrator. The light sources surround an axis, and the axis passes through a center of the light incident surface and is perpendicular to the light incident surface. Each of the light sources is capable of emitting a beam along a transmitting path toward the axis. The concentrator is disposed at the axis and includes a curvy reflective surface located on the transmitting paths for reflecting the beams to the light incident surface of the optical fiber.
摘要翻译： 提供光耦合到具有光入射表面的光纤的光源模块。 光源模块包括多个光源和集中器。 光源围绕轴线，并且轴线穿过光入射表面的中心并且垂直于光入射表面。 每个光源能够沿着发射路径朝向轴发射光束。 集中器设置在轴线处，并且包括位于传输路径上的弯曲反射表面，用于将光束反射到光纤的光入射表面。
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公开(公告)号：US08946987B2
公开(公告)日：2015-02-03
申请号：US13730787
申请日：2012-12-28
发明人： Chia-Fen Hsieh , Chien-Chun Lu , Ya-Hui Chiang , Chen-Peng Hsu , Hung-Lieh Hu
CPC分类号： H01L33/505 , H01L33/508 , H01L33/60 , H01L2924/0002 , H01L2933/0041 , H05B33/10 , H01L2924/00
摘要： A light emitting device and a fabricating method thereof are described, wherein the light emitting device includes a substrate, a wall, a first LED chip and a light conversion filling. The first LED chip is disposed on a surface of the substrate. The wall is disposed on the surface of the substrate, and surrounds the first LED chip. A first angle between a central axis of the wall and an inner surface of the wall is 0 degree or is acute, a second angle between the central axis of the wall and an outer surface of the wall is 0 degree or is acute, and the outer surface of the wall and the substrate has a space therebetween. The light conversion filling is surrounded by the light conversion wall, and is disposed on the first LED chip.
摘要翻译： 描述了发光器件及其制造方法，其中发光器件包括衬底，壁，第一LED芯片和光转换填充物。 第一LED芯片设置在基板的表面上。 壁布置在基板的表面上，并围绕第一LED芯片。 壁的中心轴线和壁的内表面之间的第一角度为0度或是锐角，壁的中心轴线与壁的外表面之间的第二角度为0度或是尖锐的，并且 壁和基板的外表面之间具有间隔。 光转换填充物被光转换壁包围，并且设置在第一LED芯片上。
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公开(公告)号：US20150002027A1
公开(公告)日：2015-01-01
申请号：US14485886
申请日：2014-09-15
发明人： Sheng-Ho Huang , Hung-Lieh Hu , Chen-Kun Chen , Yu-Chen Yu
IPC分类号： H05B33/08
CPC分类号： H05B33/0854 , H05B33/0872 , H05B37/0227 , H05B37/0245 , H05B37/029
摘要： A multi-function lighting system is provided. A design of multiplex configuration of a multi-diode lighting module and a design of optical time domain modulation of an electric controlling system are applied to a lighting system which senses environmental conditions to automatically or artificially change a color, a light intensity and a color-temperature of a light to influence people's feelings and moods. At the same time, the environmental sensing device further feedbacks an information of humidity or temperature so that parameter of optimum light environment can be set accordingly. The multi-diode lighting module is applied to the design of the lighting system, such that the lighting system can be manufactured in a customization way to meet varied requirements in the landscaping and optical designs, not only reducing the cost and increasing mass production rate but also providing multi-functions including landscaping lighting, ergonomic lighting, plant lighting and air purifying.
摘要翻译： 提供多功能照明系统。 将多极二极管照明模块的多路复用配置设计和电气控制系统的光时域调制设计应用于感测环境条件的照明系统，以自动或人为地改变颜色，光强度和颜色 - 光的温度影响人们的感受和心情。 同时，环境感测装置进一步反馈湿度或温度的信息，从而可以相应地设定最佳光照环境的参数。 多重二极管照明模块适用于照明系统的设计，使得照明系统可以以定制的方式制造，以满足园林绿化和光学设计的不同要求，不仅降低了成本并提高了批量生产率， 还提供多种功能，包括景观照明，人体工程学照明，植物照明和空气净化。
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公开(公告)号：US20140327025A1
公开(公告)日：2014-11-06
申请号：US14267919
申请日：2014-05-02
发明人： Re-Ching Lin , Shih-Yi Wen , Chen-Peng Hsu , Hung-Lieh Hu , Yu-Chen Yu , Chia-Fen Hsieh
IPC分类号： H01L33/50
CPC分类号： H01L33/501
摘要： A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.
摘要翻译： 提供了包括芯片载体部分，发光二极管芯片和封装材料的发光二极管封装结构。 发光二极管芯片设置在封装的芯片载体部分上。 封装材料填充在芯片载体部分中并覆盖发光二极管芯片。 包装材料包括基质材料，多个第一粉末颗粒和多个第二粉末颗粒。 第一粉末颗粒和第二粉末颗粒分布在基质材料中。 每个第一粉末颗粒是波长转换材料。 每个第二粉末颗粒具有壳状结构。
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