Invention Grant
- Patent Title: Semiconductor devices and methods of forming the same
- Patent Title (中): 半导体器件及其形成方法
-
Application No.: US13957912Application Date: 2013-08-02
-
Publication No.: US09252235B2Publication Date: 2016-02-02
- Inventor: Donghyun Roh , Pankwi Park , Dongsuk Shin , Chulwoong Lee , Naein Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR1020120105406 20120921
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L29/66 ; H01L21/8234

Abstract:
According to embodiments of the inventive concept, a gate electrode is formed on a substrate, and a first spacer, a second spacer, and a third spacer are sequentially formed on a sidewall of the gate electrode. The substrate is etched to form a recess region. A compressive stress pattern is formed in the recess region. A protective spacer is formed on a sidewall of the third spacer. When the recess region is formed, a lower portion of the second spacer is removed to form a gap region between the first and third spacers. The protective spacer fills the gap region.
Public/Granted literature
- US20140087535A1 SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME Public/Granted day:2014-03-27
Information query
IPC分类: