Invention Grant
- Patent Title: Method of forming a fine pattern of a semiconductor device
- Patent Title (中): 形成半导体器件的精细图案的方法
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Application No.: US14082280Application Date: 2013-11-18
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Publication No.: US09257297B2Publication Date: 2016-02-09
- Inventor: Byoung-Yong Gwak
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2012-0140999 20121206
- Main IPC: H01L21/461
- IPC: H01L21/461 ; H01L21/308 ; H01L21/033 ; H01L21/311 ; H01L45/00 ; H01L27/22 ; H01L27/24 ; H01L27/108 ; H01L27/115

Abstract:
A method of forming a fine pattern includes forming first line mask patterns on a mask layer to extend along a direction, forming second line mask patterns to extend along a diagonal direction with respect to the first line mask patterns, anisotropically etching the mask layer exposed by the first and second line mask patterns to form elliptical openings, and isotropically etching the mask layer provided with the openings to form a mask pattern with enlarged openings.
Public/Granted literature
- US20140162427A1 METHOD OF FORMING A FINE PATTERN OF A SEMICONDUCTOR DEVICE Public/Granted day:2014-06-12
Information query
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