Invention Grant
- Patent Title: Hybrid graphene-metal interconnect structures
- Patent Title (中): 混合石墨烯 - 金属互连结构
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Application No.: US13873356Application Date: 2013-04-30
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Publication No.: US09257391B2Publication Date: 2016-02-09
- Inventor: Junjing Bao , Griselda Bonilla , Samuel S. Choi , Ronald G. Filippi , Naftali E. Lustig , Andrew H. Simon
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GlobalFoundries, Inc.
- Current Assignee: GlobalFoundries, Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Anthony J. Canale
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/44 ; H01L23/532 ; H01L23/528 ; B82Y40/00 ; B82Y30/00 ; H01L21/768

Abstract:
Hybrid metal-graphene interconnect structures and methods of forming the same. The structure may include a first end metal, a second end metal, a conductive line including one or more graphene portions extending from the first end metal to the second end metal, and one or more line barrier layers partially surrounding each of the one or more graphene portions. The conductive line may further include one or more intermediate metals separating each of the one or more graphene portions. Methods of forming said interconnect structures may include forming a plurality of metals including a first end metal and a second end metal in a dielectric layer, forming one or more line trenches between each of the plurality of metals, forming a line barrier layer in each of the one or more line trenches, and filling the one or more line trenches with graphene.
Public/Granted literature
- US20140319685A1 Hybrid Graphene-Metal Interconnect Structures Public/Granted day:2014-10-30
Information query
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