Invention Grant
- Patent Title: Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package
- Patent Title (中): 屏蔽，封装结构和具有半导体封装的屏蔽和制造方法的半导体封装
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Application No.: US13919176Application Date: 2013-06-17
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Publication No.: US09257394B2Publication Date: 2016-02-09
- Inventor: Kuang-Neng Chung , Hsin-Lung Chung , Tien-Chung Huang , Tsung-Hsien Hsu
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW102113754A 20130418
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/32 ; H01L23/31 ; H01L21/56 ; H01L23/00
Abstract:
A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. Therefore, the shield is precisely positioned on the substrate.
Public/Granted literature
Information query
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