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公开(公告)号：US20150366085A1
公开(公告)日：2015-12-17
申请号：US14564180
申请日：2014-12-09
发明人： Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Hao-Ju Fang , Kuang-Neng Chung
CPC分类号： H05K1/111 , H01L21/565 , H01L23/3128 , H01L23/58 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00014
摘要： A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.
摘要翻译： 提供了一种封装结构，其包括：具有相对的第一和第二表面的基板; 至少设置在所述基板的第一表面上的电子元件; 以及形成在所述基板的所述第一表面上以封装所述电子元件的密封剂。 密封剂具有非矩形形状，以减少密封剂中的无效空间。
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2.发明申请SHIELD, PACKAGE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SHIELD AND FABRICATION METHOD OF THE SEMICONDUCTOR PACKAGE 有权具有半导体封装的屏蔽和制造方法的封装，封装结构和半导体封装公开(公告)号：US20140312473A1
公开(公告)日：2014-10-23
申请号：US13919176
申请日：2013-06-17
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L23/552 , H01L21/561 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/16152 , H01L2924/19105 , H01L2224/85
摘要： A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. Therefore, the shield is precisely positioned on the substrate.
摘要翻译： 公开了一种半导体封装的制造方法，其包括以下步骤：提供至少具有承载区域和限定在其表面上的切割区域的基板，其中所述切割区域围绕所述承载区域; 在所述基板的承载区域上设置至少一个电子元件; 在所述基板的承载区域设置具有凹部的至少一个定位构件的屏蔽件，并且所述电子元件容纳在所述凹部中，并且所述定位构件向外延伸到所述切割区域; 以及沿切割区域执行切割处理以去除定位构件和基底的部分。 因此，屏蔽件精确地定位在基板上。
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公开(公告)号：US09526171B2
公开(公告)日：2016-12-20
申请号：US14564180
申请日：2014-12-09
发明人： Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Hao-Ju Fang , Kuang-Neng Chung
CPC分类号： H05K1/111 , H01L21/565 , H01L23/3128 , H01L23/58 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00014
摘要： A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.
摘要翻译： 提供了一种封装结构，其包括：具有相对的第一和第二表面的基板; 至少设置在所述基板的第一表面上的电子元件; 以及形成在所述基板的所述第一表面上以封装所述电子元件的密封剂。 密封剂具有非矩形形状，以减少密封剂中的无效空间。
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4.发明授权Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package 有权屏蔽，封装结构和具有半导体封装的屏蔽和制造方法的半导体封装公开(公告)号：US09257394B2
公开(公告)日：2016-02-09
申请号：US13919176
申请日：2013-06-17
IPC分类号： H01L23/552 , H01L23/32 , H01L23/31 , H01L21/56 , H01L23/00
CPC分类号： H01L23/552 , H01L21/561 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/16152 , H01L2924/19105 , H01L2224/85
摘要： A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. Therefore, the shield is precisely positioned on the substrate.
摘要翻译： 公开了一种半导体封装的制造方法，其包括以下步骤：提供至少具有承载区域和限定在其表面上的切割区域的基板，其中所述切割区域围绕所述承载区域; 在所述基板的承载区域上设置至少一个电子元件; 在所述基板的承载区域设置具有凹部的至少一个定位构件的屏蔽件，并且所述电子元件容纳在所述凹部中，并且所述定位构件向外延伸到所述切割区域; 以及沿切割区域执行切割处理以去除定位构件和基底的部分。 因此，屏蔽件精确地定位在基板上。
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