Invention Grant
- Patent Title: Electronic devices and method of fabricating the same
- Patent Title (中): 电子器件及其制造方法
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Application No.: US13952904Application Date: 2013-07-29
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Publication No.: US09257579B2Publication Date: 2016-02-09
- Inventor: Sun Jin Yun , Chang Bong Yeon , Yoo Jeong Lee , JungWook Lim
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2012-0083394 20120730; KR10-2013-0053136 20130510
- Main IPC: H01L31/056
- IPC: H01L31/056 ; H01L31/0232 ; H01L31/18 ; H01L31/0224 ; H01L31/0236 ; H01L51/52 ; H01L33/40 ; H01L21/00
Abstract:
Provided is a method of fabricating an electronic device. The method according to the present inventive concept may include forming a lower electrode having a flat portion and protrusions on a substrate, forming an intermediate layer on the lower electrode, and forming an upper electrode on the intermediate layer. The forming of the lower electrode may include forming a conductive film by depositing a first metal on the substrate, and depositing a second metal on the conductive film to prepare an alloy of the first metal and the second metal.
Public/Granted literature
- US20140026963A1 ELECTRONIC DEVICES AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-01-30
Information query
IPC分类:
