发明授权
- 专利标题： Lead-free solder and electronic component built-in module
- 专利标题（中）： 无铅焊料和电子元件内置模块
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申请号： US13005838申请日： 2011-01-13
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公开(公告)号： US09258905B2公开(公告)日： 2016-02-09
- 发明人: Tsutomu Yasui , Hisayuki Abe , Kenichi Kawabata , Tomoko Kitamura
- 申请人： Tsutomu Yasui , Hisayuki Abe , Kenichi Kawabata , Tomoko Kitamura
- 申请人地址： JP Tokyo
- 专利权人： TDK CORPORATION
- 当前专利权人： TDK CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff PLC
- 优先权： JP2010-017145 20100128
- 主分类号： H01R9/00
- IPC分类号： H01R9/00 ; H05K3/34 ; B23K35/02 ; B23K35/26 ; B23K35/30
摘要：
A first solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy. An electronic component built-in module may include an electronic component and a substrate on which the electronic component is installed, where a terminal of the electronic component and a terminal of the substrate are joined together by using the lead-free solder.