发明授权
- 专利标题： Chemical mechanical polishing pad with polishing layer and window
- 专利标题（中）： 化学机械抛光垫与抛光层和窗户
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申请号： US14228660申请日： 2014-03-28
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公开(公告)号： US09259820B2公开(公告)日： 2016-02-16
- 发明人: Bainian Qian , Marty W. DeGroot , James Murnane , Angus Repper , Michelle Jensen , Jeffrey J. Hendron , John G. Nowland , David B. James , Fengji Yeh
- 申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. , Dow Global Technologies LLC
- 申请人地址： US DE Newark US MI Midland
- 专利权人： Rohm and Haas Electronic Materials CMP Holdings, Inc.,Dow Global Technologies LLC
- 当前专利权人： Rohm and Haas Electronic Materials CMP Holdings, Inc.,Dow Global Technologies LLC
- 当前专利权人地址： US DE Newark US MI Midland
- 代理商 Thomas S. Deibert
- 主分类号： B24B37/20
- IPC分类号： B24B37/20 ; B24B37/013 ; B24B49/12 ; H01L21/306 ; G02B1/12 ; H01F41/00
摘要：
A chemical mechanical polishing pad is provided having a polishing layer; and an endpoint detection window incorporated into the chemical mechanical polishing pad, wherein the endpoint detection window is a plug in place window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: a window prepolymer, and, a window curative system, comprising: at least 5 wt % of a window difunctional curative; at least 5 wt % of a window amine initiated polyol curative; and, 25 to 90 wt % of a window high molecular weight polyol curative.
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